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OMG BOOKSOURCE |
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OMG BOOKSOURCE |
OMG BOOKSOURCE is pleased to present you with their latest multi-media comprehensive catalog of audiovisual materials covering the subject areas of
HAND SOLDERING FOR TERMINALS
Video
A visual explanation of tinning the soldering iron tip, stripping the
insulated wire, tinning the wire and cleaning the iron tip.
Demonstrates the proper method of attaching and soldering wires to turret
terminals, cup terminals, bifurcated terminals, hook terminals, and pierced
terminals. Discusses the importance of soldering for inspectability Provides the
criteria for recognizing the preferred solder joint, along with the minimum and
maximum standards for acceptability. Includes Leader’s guide and
student workbook. Time 25
Min.
ORDER CODE- PCB500
HAND SOLDERING THROUGH-HOLE COMPONENTS W/TRAINING
CERTIFICATION (2 TAPES)
Video
Now you can train and certify
your hand soldering technicians. There's no better way to demonstrate, in
microscopic detail, the essential theory of the hand soldering process.
VT-42/43C will help your students better understand soldering fundamentals
before they receive hands-on training. Objectives, Section Review
Questions, and Certification Testing insure that all of your students
demonstrate competency per ISO requirements. Also includes printable
certificates for students with a passing grade. VT-42 visually
demonstrates workstations practices, personal safety considerations, ESD
prevention, soldering iron types, temperature selection, tip types and
applications, heat transfer principles, how to avoid thermal damage, solder
types / sizes and application, flux theory, low residue fluxes, and wetting
principles. VT-3 covers hand soldering procedures for soldering through
hole components onto printed circuit boards, tip tinning, tip / tool
maintenance, reheating solder, heat sinks / thermal shunts, soldering thick
boards, preheating, cleaning flux residues, and solder joint workmanship
requirements from IPC-A-610C, including excessive solder, solder bridging,
solder projections, solder balls, nonwetting, dewetting, blowholes, pinholes and
product classes per J-STD-001C. Time: 40 minutes total, on two videotapes.
ORDER CODE- PCB502
HAND SOLDERING
WITH LOW RESIDUE FLUX
Video
Explains what a low residue flux is and how it compares to other fluxes.
Describes changes to the existing hand soldering process and covers hand
soldering theory with low residue fluxes. Discusses visual inspection criteria
for solder joints and flux residues, wetting considerations, and the importance
of the solder heat bridge. Other topics covered
are ideal solder feed rates
and techniques, lower temperature
soldering and the increases importance of tip maintenance. Soldering
demonstrations include through –hole components, gull wings, J-Leads and
turret terminals. This video can be used to train new hires or as a refresher
for technicians who have been hand soldering for years. It can also help clarify
the important reasons to modify existing hand soldering techniques.
Includes a leader’s guide and student workbook. Time: 33 Min.
ORDER CODE- PCB504
COMPONENT
PREPARATION AND MANUAL INSERTION
Video
An introductory overview of
the component preparation and manual insertion process. A cast of animated
characters explain the kitting or picking process, temporary solder mask
application, lead preparation/performing (using
manual and mechanical systems.) stress relief theory, lead crimping, lead
contamination, legends, component orientation and polarization, adhesive
bonding, assembly line operation, ESD basics, personal safety issues, and end
product acceptance criteria from the IPC-A-610. Includes leader’s guide and
student workbook. Time:
30 Min.
ORDER CODE- PCB506
WAVE SOLDERING
Video
Provides an in-depth look at
the wave soldering process, beginning with typical setup / adjustment procedures
for conveyors, control, spray, foam and wave fluxers (including rosin , water
soluble, and low residue fluxes),
convection and radiation preheaters, air knives, and wave adjustment. Also
explains thermal profiles, solder compositions, wave shapes and purposes.
Reviews standard operating procedures, including adding solder, removing dross,
proper clothing, safety requirements and board stiffeners. A final section on
troubleshooting examines common defects, causes and solutions. Includes
Leader’s Guide and Student Workbook.
Time: 37 Min.
ORDER CODE- PCB508
INTRODUCTION TO THROUGH-HOLE ASSEMBLY
Video
An introductory overview of
the through-hole assembly processes. Begins with a description of the basic
functions of typical components and interconnections, component location grids;
letter codes and polarity markings. Provides a visual explanation of DIP
insertion, axial insertion , lead performing/manual insertion.
Also reviews wave soldering, hand soldering, cleaning and testing.
Discusses common problems to avoid and stresses the importance of the individual
operator throughout the process. A useful introduction
for new hires and general education. Includes Leader’s guide
and Student Workbook.
Time: 29 Min.
ORDER CODE- PCB510
THROUGH-HOLE SOLDER JOINT
EVALUATION
Video
Dozens of microphotographs
combine with detailed computer animation to provide assembly inspectors with the
essential knowledge required to make pass/fail decisions on through-hole
assemblies. This video looks at how a solder joint is made and explains key
terminology including wetting, fillet, contact angle and the parts of a solder
joint. The second section details minimum acceptable conditions. Using computer
animation, each of the five criteria listed in those standards are carefully and
completely explained. The last section of the video covers solder defects and
conditions and explains the acceptance criteria for each class of assemblies.
Emphasis is placed on understanding the difference between cosmetically
imperfect but acceptable solder joints and those which fall below minimum
acceptable levels, as well as the pitfalls of unnecessary rework. Includes a
Leader’s Guide and matching Learner’s Workbook. Also includes a copy of the
32 page Through-Hole Solder Joint Evaluation Desk Reference Manual.
ORDER CODE- PCB512
SURFACE MOUNT SOLDER JOINT
EVALUATION
PART 1: INTRODUCTION
Video
Explains the history of
component evolution from through-hole to surface mount, the advantages of SMT,
defines 3 classes of products based on the ANSI/J-STD-001B specification,
discusses the causes of solder joint imperfections, and defines related
terminology. Also identifies the different types of discrete chip components and
metallizations, and provides and introductory example of how to analyze the
acceptance criteria and dimensional requirements for minimum
/maximum solder conditions. Automatic placement, solder paste adhesive
application, wave soldering, and reflow soldering are also demonstrated.
Includes Leader’s Guide, Student Workbook and DRM-SMT.
Time; 25 Min.
ORDER CODE- PCB514
SURFACE
MOUNT SOLDER JOINT EVALUATION,
PART 2: RECTANGULAR CHIP COMPONENTS
Video
Analyzes rectangular chip component solder joints typical failure mechanisms and
decisions for rework. Provides the dimensional criteria from the ANSI/J-STD-001
Specification for all three classes of products, including Maximum Side Overhang
, Minimum End Joint Width, Minimum End Overlap, Minimum Solder Joint Height, and
Maximum solder Thickness . Also reviews typical soldering defects and causes.
Insufficient and excessive solder, contact angles, drawbridging
and tombstoning, webbing, disturbed or cold solder joints, solder
bridging, solder balls and mounting adhesive inside solder joints. Voids,
pinhole, pits, blowholes, nonwetting and dewetting for 1,2,3 and 5 face
rectangular chip components are also covered. Includes Leader’s Guide Student
workbook, and DRM-SMT. Time: 25
Min.
ORDER CODE- PCB516
SURFACE
MOUNT SOLDER JOINT EVALUATION,
PART 3:
BOTTOM ONLY & MELFs
Video
Covers bottom only and MELF
surface mount chip components, including components identification, wetting,
contact angles, nonwetting, shadowing, dewetting, smoothness, grain texture,
contamination, voids, blowholes, solder volume, and all types of dimensional
requirements for minimum solder join sizes/overhangs. The acceptance criteria
comes from the ANSI/J-STD-001B covering consumer, commercial and hi-rel
requirements. Includes Leader’s Guide, Student workbook, and DRM-SMT. Time:
22 Min.
ORDER CODE- PCB518
SURFACE
MOUNT SOLDER JOINT EVALUATION
PART 4: GULL WING COMPONENTS
Video
Defines the acceptance
criteria for gull wing component – surface mount solder joints (QFPs, SOICs,
SOTs) as described in
ANSI/J-STD-001B for minimum/maximum solder
joint sizes. Includes discussion on lead coplanarity, typical
problems, solder bridging , preferred fillet configuration , thermal
expansion considerations visibility and inspectability, and misalignment
criteria for all types of component overhangs. Includes
Leader’s Guide, Student Workbook and DRM-SMT. Time: 23 Min.
ORDER CODE- PCB520
ELECTROSTATIC DISCHARGE (ESD)
CONTROL
Video
Explains the causes of static
electricity, and demonstrates the effects of ESD buildup on electronic
components. Emphasizes operator prevention of charge buildups. Also discusses
charge neutralization, dissipation, static fields, and protection during
handling transportation, and storage. This video is useful for new employees and
continuing education. Includes Leader’s Guide and Student Workbook.
Time: 24 Min.
ORDER CODE- PCB522
ESD
CONTROL TRAINING
CD-Rom
This interactive CD-ROM is powerful, three-tier product designed for training
assembly operators, technicians, and other personnel who spend time on the
production floor. There are two levels of training available.- basic and
advanced – which allow the training to be more closely matched to the
individual’s needs. These sections focus on the how-to’s of ESD Control,
such as preventing static charges, neutralizing charges, and protecting devices
from static fields. Each chapter
contains a test module, along with a final certification test. The
administrative module tracks each user’s
score, and allows for elimination of irrelevant
subject material. The
Resources Section. Includes; the ESD Association’s 175 page Handbook: Advisory
for Protection and Sensitivity Training of Electronic Discharge Susceptible
Items, as well as articles, book excerpts, Lists
of organization, book/periodical references, extensive glossary and index,
designed to support the ESD Control Manager. Program contents are “user
customizable” allowing the training manager to add company specific contents.
(Runs on any Windows Multimedia platform.
ORDER CODE- PCB524
LAND AND CONDUCTOR REPAIR FOR ELECTRONIC ASSEMBLIES
Video
Explains common repair techniques for printed circuit assemblies, Each
procedure includes damage
analysis, industry approved repair procedures and evaluation criteria.
Tape A covers laminate damage repair, rebonding isolated surface mount lands using adhesive bonding film and adhesive backed replacement lands, and rebonding lifted
Conductors using liquid epoxy overbond. Tape B covers conductor replacement with adhesive backed material and liquid epoxy,, repairing gaps in conductors, replacing straight and bent conductors, surface mount land/conductor replacement with adhesive backed material and solder mask replacement . 2 videotapes. Includes Leader’s Guides and Student workbook. Time: 2 videotapes - Time : 57 Min.
ORDER CODE- PCB526
PLATED – THROUGH HOLE REPAIR
Video
This third tape in a series on Land and
Conductor Repair demonstrate the industry standard eyelet repair procedure for a
damaged plated through hole (without innerlayer connections) as described in
IPC-7721. Begins by explaining when to repair a through-hole, selection of the
replacement eyelet - including measurements for board thickness, inside and
outside eyelet diameter, length under the flange, flange diameter, and related
tolerances. Also covers hole redrilling, funnel and flat swaging eyelets,
soldering and conductor replacement. Includes Leader’s Guide and Student
Workbook. Time: 22 Min.
ORDER CODE- PCB528
THROUGH-HOLE REWORK
Video
Begins by introducing the
current industry specifications and includes an explanation of the concepts of
Process indicators. It then continues with an animated examination of the
invisible problems that can be created during rework to stress why it’s so
important to avoid unnecessary rework. Reviews each of the tools and materials
for through hole rework (including low residue fluxes) Individual sections cover
vacuum extraction of straight-through (round) leads partially and fully clinched
leads, DIP and auxiliary heating techniques for large thermal mass boards and
inaccessible leads. Also explains industry approved rework techniques for solder
defects, including solder bridges, icicles and excess /insufficient solder.
Includes Leader’s Guide and Student Workbook .
Time: 45 Min.
ORDER CODE- PCB530
INTRODUCTION TO SURFACE MOUNT
REWORK
Video
Stresses the importance of avoiding
unnecessary rework and shows how a cosmetic fix can create more problems that it
solves – including damage to the component, the board
and adjacent solder joints. Provides guidelines for rework decisions and
basic acceptances criteria. Also covers: flux usage and residues, pre cleaning,
prebaking , flux cored solder types and thicknesses, solder paste
application and volume. Discusses
practical theory and application criteria for each of the conductive and
convective heating systems used in
surface mount rework. Includes Leader’s Guide and Student workbook
ORDER CODE- PCB532
REWORK OF SURFACE MOUNT CHIP
COMPONENTS
Video
Begins with an explanation of
chip component terminology and size codes. Details flux considerations, and land
preparation using solder braid and vacuum extractor. Demonstrates industry
approved techniques and common problems to avoid during
removal and replacement of all types of chip components using the
following hand tools; hand soldering iron (single point and bifurcated tip)
pulse heat tweezers, continuous heat
tweezers; and hot air pencil. Also explains adhesive bonded components,
and special heating considerations for ceramic chip capacitors. Includes
Leader’s Guide and Student workbook.
Time: 2 videotapes – 50 minutes total.
ORDER CODE- PCB534
GULL WING REWORK
Video
High quality microphotography and
computer animation provide precise visual instruction on industry approved
techniques for the removal of all types of gull wing components (QFPs, SOICs,
TSOPs, and SOTs) using hand soldering iron, thermal tweezers, and thermal vacuum
pick. Land preparation using solder braid and vacuum extraction, and component
replacement using a hand soldering
iron, hot air pencil continuous flow solder , and
hot bar are demonstrated. Also covers gull wing component. ID/ handling,
tool preparation and maintenance, and heat enhancement techniques. Includes 2
videotapes, Leader’s Guide, Student workbook.
Time: 60 Mins.
ORDER CODE- PCB536
BALL GRID ARRAY REWORK
Video
Begins with a discussion of the
advantages and challenges of ball grid arrays, including component descriptions
and terminology. Provides an overview of removal /replacement procedures for
ball grid arrays, using hot air and conductive heating equipment. Covers site
preparation, component alignment, solder paste printing, and preheating
considerations. Explores potential problems, including moisture sensitivity.
heating of adjacent components/solder joints, and potential soldering defects.
Also reviews X-ray techniques for solder joint inspections/ evaluation.
Includes Leader’s Guide and Student Workbook.
Time: 15 Min.
COMPONENT IDENTIFICATION
Video
A cast of characters attempts
to rebuild their doomed spaceship by scavenging components from 20th
century electronic products. Identifies dozens of electronic components and
introduces the viewer to component terminology, polarity values and much more.
Both common and less familiar through-hole and surface mount components are
shown and explained. Also included is a comprehensive Leader’s Guide, matching
student workbook and a copy of the 64 page Component ID Desk Reference Manual
described below. Time:
35 Min.
ORDER CODE- PCB542
INTRODUCTION
TO SURFACE MOUNT ASSEMBLY
Video
An introductory overview of
the surface mount assembly processes. Begins with a review of component
evolution from through-hole to surface mount, then describes the standard
component types. Explains the solder paste printing process, mixed technology
assemblies, including adhesive application, autoplacement of components, reflow
soldering infrared, (convection and combination) visual inspection, cleaning
secondary reflow, electrical and burn-in testing. A useful introduction for new
hires, cross training, and general education.
Includes Leader’s Guide and Student Workbook.
Time: 30 Min .
ORDER CODE- PCB544
PRINTED CIRCUIT OVERVIEW
Video
Produced for non-technical
audience including sales, administrative, and management, to explain where
printed circuit boards fit into electronic products and the global electronics
industry. Begins with an overview of electronic chips components, then describes
the history and function of printed circuits, including a visual tour of a
typical double sided and multiplayer fabrication process. Provides an
explanation of the uses and manufacturing processes for related materials,
including copper foil and various laminates types, then describes industry
market sizes and future trends. Also includes a visual overview of both
through-hole and surface mount component assembly operations. Viewers should
absorb basic terminology, and an appreciation for the importance of quality and
innovation. A valuable introduction and orientation to the printed circuit
industry for industry suppliers, colleges, technical/vocational schools,
employment recruiting and material suppliers.
ORDER CODE- PCB546
INTRODUCTION TO PWB FABRICATION
Video
Designed for employees new to
PWB fabrication. Explains the history and function of the circuit board in
perspective to the electronics industry.
Provides a visual tour of a typical multiplayer facility. Also covers
personal safety, drugs and alcohol, product handling issues, communication with
supervisors, and personal attitude. Also
explains typical business costs and the importance of the individual operator
toward the success the company.
Time: 18 Min.
ORDER CODE- PCB548
BASIC MULTILAYER FABRICATION
Video
A complete overview of each of
the manufacturing processes for a conventional 6 layer, pin registered MLB.
Explains innerlayer print and etch
process, and outerlayer SMOBC.
Includes action photography, computer graphics and sample microphotographs at
each of the process steps. An important introductory video for all new employees
who will benefit from an understanding of this process.
Time: 35 Min.
ORDER CODE- PCB550
DOUBLE-SIDED BOARD FABRICATION
Video
Visually explains each of the
process steps in the doublesided pattern plate, tin-lead reflow manufacturing
process. Includes action photography, computer graphics and microphotographs at
each of the process steps. Time: 23 Min.
ORDER CODE- PCB552
FLEXIBLE CIRCUITS MANUFACTURING
Video
Introduces each of the process
steps in the doublesided, pattern plate, tin-lead reflow manufacturing process.
Includes action photography, computer graphics and microphotographs
at each of the process steps. Time: 30 Min.
ORDER CODE- PCB554
BARE BOARD HANDLING
Video
Explains the importance of each
person’s contribution to the success of the circuit board manufacturing
process. Provides an interactive format, allowing groups of operators to discuss
the causes of handling damage within their specific process. Question and answer
sections encourage groups to come up with their own solutions to prevent common
handling defects. A valuable tool to help promote careful handling and reduce
unnecessary defects. Time:
20 Min.
ORDER CODE- PCB556
SAFETY IN PWB MANUFACTURING
Video
Avoiding incident and injury
is the focus of this important video. Each person is encouraged to be
responsible for personal safety in the workplace. Also discusses a wide variety
of safety equipment from personal clothing to emergency eyewashes and showers.
Material Safety Data Sheets are explained. The hazards of drug and alcohol use
and its implications for safety in the workplace are explored.
Time: 27 Min.
ORDER CODE- PCB558
CHEMICAL SAFETY IN PWB FABRICATION
Video
Takes a serious look at handling of potentially hazardous chemicals used
in the manufacture of printed circuit boards. All facilities must train
employees that mix, store, dispose of or transport any hazardous substance. The
basics of what to do in case of a chemical emergency are explained.
Time: 27 Min.
ORDER CODE- PCB560
INNERLAYER
HANDLING SERIES,
PART 1: INCOMING INSPECTION FABRICATION SHEARING, AND TOOLING / REGISTRATION
Video
An explanation of the defects
that can be caused by improper handling during incoming inspection, shearing,
and tooling/registration. The purpose of each of these innerlayer
abrication processes is explained and correct procedures are
demonstrated. Visual examples of acceptable and rejectable products are
provided, illustrating the range of allowable variation.
Time: 22 Min.
ORDER CODE- PCB562
INNERLAYER HANDLING
SERIES,
PART 2: PRE-IMAGE CLEANING
Video
Explains three techniques:
mechanical scrubbing, pumice scrubbing, and chemical cleaning. Visual examples
of acceptable and rejectable conditions are provided, illustrating the range of
allowable variation. Operators are shown how improper handling will affect the
product immediately and down the line. Pre-image cleaning may be the most
critical processing step in the fabrication of multiplayer boards, and perhaps
the most neglected. It is important to understand the theory of the cleaning
operation, and why it is essential to do it right.
Time: 21 Min.
ORDER CODE- PCB564
INNERLAYER HANDLING SERIES,
PART 3: RESIST LAMINATION
Video
Addresses the problems of
photoresist in a way from which both new employees and experienced operators
will learn. Includes set up for speed, pressure, heat, registration, and
explores typical factors that create exposure or resist adhesion problems, such
as improper cleaning, contamination, fingerprints, oxidation, and foreign
particles. Explains the effects of bubbles, wrinkles, scratches, gouges, dents,
resist chips, and roller imperfections. Discusses the role of protective
clothing, trimming, and visual inspection. Time: 31 Min.
ORDER CODE- PCB566
INNERLAYER HANDLING SERIES, PART
4: IMAGING
Video
Videotape #1, analyzes the
theory of the print & etch innerlayer imaging operation and
provides an overview of each of the processing steps in typical
multiplayer fabrication. Explains diazo and silver halide phototools. Various
tooling arrangements, light collimation and deflection, image enlargement,
integrator theory, and the step tablet calibration process. Videotape #2 covers
standard operation procedures, the importance of cleanliness and air filtration,
the effects of dust and other airborne contaminants, protective clothing,
fingerprint contamination, resist particles, preventive cleaning techniques.
Static problems and ionization theory, wear and tear on phototools and tooling
holes, scratches in exposure surfaces and the function of the cover sheet. Time:
2 videotapes- 42 Mins. Total
ORDER CODE- PCB568
INNERLAYER HANDLING SERIES,
PART 5: DEVELOPING
Video
This video explains the innerlayer developing process, and the defects
that can be created by improper handling, variations in machine setup, and
chemistry. Reviews the effects of each of these conditions during further
processing. Time: 16 Min.
ORDER CODE- PCB570
INNERLAYER HANDLING SERIES.
PART 6: ETCH / STRIP
Video
Details innerlayer etch/strip operations, focusing on four variables: solution
chemistry, conveyor speed, spray pressure, and temperature control. Operator
safety and handling considerations are covered. Includes Leader’s Guide and
Student Workbook .
Time: 18 Min.
ORDER CODE- PCB572
INNERLAYER HANDLING SERIES,
PART 7: LAMINATION
Video
Details pin registration lay-up and lamination processes and explains the step
by step sequence of laying up a typical multiplayer panel. Proper handling of
caul plates, separator plates, copper foil, prepreg sheets
and innerlayer is described. The
lamination section examines three different types of vacuum press systems;
vacuum enclosed presses, vacuum frames and turkey bag system. Also
contains a description of the process for mass lamination and a brief discussion
of automatic optical inspection (AOL) and surface treatment operations. Includes
Leader’s Guide and Student Workbook. Seventh and final video in the innerlayer
Handling Series. Time: 29 Min.
ORDER CODE- PCB574
LIQUID PHOTO-IMAGEABLE SOLDER MASK
Video
Begins by explaining the purpose and advantages of liquid photo-imageable solder
mask. Visually examines each step in the application process, including surface
preparation (both abrasive and chemical pre-wash), screen and curtain coating
(including thickness evaluation), tack drying , exposure (including
environmental controls, clothing, artwork alignments, and machine operation/
maintenance), developing (including machine operation for both
aqueous and solvent systems), inspection for typical defects, and the
operation of a typical curing oven. Includes Leader’s
Guide and Student Workbook. Time:
30 Min.
ORDER CODE- PCB576
BARE BOARD ELECTRICAL TESTING
Video
A visual overview of the principles of final electrical testing for
printed circuit boards including process description for Bed of Nails and Flying
Probe systems, electrical continuity, resistance/ohms, IS and SH
shorts, OP and RO fault, capacitance
testing , lot comparison (golden board,)
net-list testing, alignment
features, adapters, probe strikes/damage, fault codes, defect analysis
systems including head’s up display, camera systems and combinations,
and an overview of conductor and solder mask repair procedures. An easy way to
introduce this relatively complex process for new hires and cross training.
Includes Leader’s Guide and Student Workbook.
Time: 29 Min.
ORDER CODE- PCB578
INCOMING INSPECTION OF LAMINATES
Video
Reviews each of the extensive tests for laminate integrity. Provides
visual examples of laminate defects and explains their defects on board quality
during further processing. Also demonstrates how to avoid damage to the laminate
caused by improper handling. Time:
12 Min.
ORDER CODE- PCB580
MATERIAL
PREPARATION
Video
Reviews the fundamentals of laminate
shearing and finishing, as well as the complex
differences between baking for cure stress-relief and moisture removal.
Your operators will learn how stresses are fabricated into the panels during
lamination; when a “stress relief” bake cycle is most desirable; what effect heating a laminate above its glass
transition temperature has on the
epoxy-resin; how the different thermal expansion coefficients of copper, glass
and resin are affected by cool down, and when
a moisture bake is performed on various types of laminates. The importance of
proper shearing and edge finishing is emphasized. The effects of loose fibers
and other surface defects on photo-resist adhesion are photographically
illustrated. Time: 16 Min.
ORDER CODE- PCB582
TOOLING AND REGISTRATION
Video
Explains each of the processes that utilize registration during printed board
fabrication and most of the common handling errors that can create
misregistration during artwork layout, tooling, drilling imaging, solder mask,
and profiling. Additional subjects include data systems for both slots and
holes, artwork compensation and verification, also minimum annular ring. A
complete understanding of the concepts of registration will enable your
operators to help prevent those
defects that result from the cumulative effects of handling errors and tolerance
buildups. Time: 34 Min.
ORDER CODE- PCB584
DRILLING
Video
Explores the mechanics of the drilling
process starting with tooling, entry and back-up materials, how to spot drill
wear and identify the defects caused by drilling double-sided, copper-clad
laminate: external burrs, nailheads and
epoxy-resin smear. Provides a general overview of programming to give the
operator an understanding of CNC drilling equipment. Also explains the
importance of proper drill feed and speed rates to minimize heat and maximize
throughput. The care and handling
of drill bits is emphasized as well as checks for misregistration and missing
holes. Time: 13 Min.
ORDER CODE- PCB586
DEBURRING
Video
Visually demonstrates how burrs become plated-over trap contaminants, weaken
hole structures, cause cracked corners and break electrical continuity.
Deburring machines require proper
set-up to protect the thin copper foil from being worn away. Operators Must
learn to read strike patterns to determine the correct pressure of brush and
backup rolls against the panel. Conveyor speeds have to be adjusted to ensure a
shiny, oxidation –free panel, and holes that are free of drilling debris and
fibers. Time:
11 Min.
ORDER CODE- PCB588
ELECTROLESS COPPER DEPOSITION
Video
A complete overview of the
process- from manual systems to automatic – explaining each of the baths:
cleaner, conditioner, microetch, predip, activator, acid dip, electroless,
antitarnish, and forced-air drying. Also covers safety requirements and incoming
inspection criteria, potential problems, filter and bath maintenance additions,
rinse efficiency (both stagnant and cascade), agitation, heaters, drip time and
drag-out, and waste treatment, Stresses the importance of controlling chemical
concentration, dwell time temperature, and pH. Concludes with a visual review of
final inspection criteria and laboratory analysis for thickness measurement,
rate panel analysis, porosity, evenness, and defect samples.
Time; 20 Min.
ORDER CODE- PCB590
IMAGING -
DRY FILM
Video
Explains the basic steps in the dry-film
imaging process: precleaning, lamination , exposure and development, how boards
are scrubbed and cleaned, how oxidation is minimized and why this is
important. Operators are trained to look
for physical defect that prevent dry-film adhesion such as fingerprints,
scratches, and other surface contamination.
The importance of proper handling procedures is emphasized. Also demonstrates proper treatment of the photoresist after
lamination and why ragged trimming of dry film edges can cause problems in the imaging process.
Panel to film alignment, and the proper inspection of phototools before
development are two more ways that operators can prevent costly errors.
Time: 18 Min.
ORDER CODE- PCB592
IMAGING – SCREEN PRINT
Video
Reviews the fundamentals of
the Screen Print Imaging Process, including screen making, thermal and UV inks,
balance between off-contact, floodbar, and squeegee pressure, setup and
adjustment of semi-automatic printers. Thoroughly illustrates common defects and
inspection requirements, cleanliness, safety considerations and process
documentation. Time: 13
Min.
ORDER CODE- PCB594
PATTERN PLATING
Video
Reviews the
fundamentals of both copper and tin/lead pattern-plating. Provides visual
examples of potential problems and explains their effects on board quality
during further processing . Also covers basic equipment (manual and automatic)
system upkeep, safety requirements, and associated quality assurance and
testing procedures. Time: 11
min.
ORDER CODE- PCB596
RESIST STRIPPING
Video
Explores the chemistry and
mechanics of all types of stripping processes: horizontal, vertical conveyorized
and batch. Both the function and
purpose of liquid and dry film resists are visually demonstrated. Also explains
why resists must be completely removed before the etching process. Operator
prevention of defects is stressed. Reviews inspection criteria for each of the
associated defects. The importance of proper handling and safety
procedures is emphasized. Time:
10 Min.
ORDER CODE- PCB598
ETCHING
Video
Provides a visual explanation
of the alkaline etching process. Contents cover proper
handling and safety precautions, chemical concentration, conveyor speeds,
the effects of etchant temperatures,
laboratory tests for specific
gravity and pH, cross section analysis uneven
spray pressures, ventilation control,
rinsing, and preventive maintenance procedures.
Visual examples of over etching , under etching, bridges, broken circuits,
nicks, pinholes, and other quality
assurance and inspection examples are examined.
Time: 16 Min.
ORDER CODE- PCB600
EDGE-BOARD CONTACT PLATING
Video
Explains the tab plating
operation from taping to inspection. Setup and adjustment, chemical concentrations, conveyor speed,
rectifier controls, plating thickness, nickel underplate, gold adherence and
reclamation, cleaning, tape testing, safety considerations, as well as an
overview of the physics and
chemistry of the plating operation,
are all explored in an easy to understand format.
Time: 11 Min.
ORDER CODE- PCB602
FUSING & SOLDER
COATING / LEVELING
Video
A review of each of the common fusing and solder leveling processes,
including hot oil, infrared, vapor phase, and hot air leveling.
Also provides visual examples of voids, dewetting, blowholes, tin-lead
silvers, and plugged holes. Discusses the causes of potential defects and the
important handling and safety procedures associated with each process. Proper
coverage of plated through holes at the knee is explained; also the formation
and consequences of intermetallic growth on long term storage and solderability.
Time: 15 Min.
ORDER CODE- PCB604
SOLDER MASK: DRY – FILM
Video
Reviews the fundamentals of
the dry film solder mask process, including surface preparation, lamination,
exposure, development, and curing. Visual examples of potential
defects are examined for their effects on board quality during further
processing. Proper handling procedures are demonstrated. Also covers associated
safety, quality assurance and testing procedures.
Time: 13 Min.
ORDER CODE- PCB606
SOLDER MASK:
SCREEN PRINT
Video
Reviews the fundamental concepts of screen making, direct and indirect
image application, surface preparation, screen printing, adjustment of
off-contact and squeegee pressure and both thermal and UV curing. Also covers
solder mask over bare copper. Visual examples of potential defects are examined
for their effects on board quality during
further processing. Proper handling procedures are demonstrated, and associated
safety, quality assurance and testing procedures are also reviewed.
Time: 15 Min.
ORDER CODE- PCB608
BLANKING ROUTING
& BEVELING
Video
The advantages and disadvantages of each process are discussed. Visual examples of improper
routing and blanking are
provided. Also covered are tooling hole differences, the importance of
proper alignment on tooling pins, the operator’s responsibility to salvage a
misaligned board before it is
blanket or routed, proper care and handling of boards, checking for die wear,
the evolution from manual to computer controlled
routing and the importance of beveling; how it’s done, and why it’s
necessary. Time: 15
Min.
ORDER CODE- PCB610
PWB INSPECTION:
IT’S EVERYONE ‘S JOB
Video
Reviews each process in the
PWB manufacturing cycle, and examines the common defects that occur during each
process. Over 60 major defects are illustrated in a thoughtful and entertaining
format. Designed to emphasize the individual operator’s responsibility to
recognize and prevent problems before they reach final inspection. Time:
16 Min.
ORDER CODE- PCB612
PACKAGING, SHIPMENT & STORAGE OF PWBs
Video
Reviews the “invisible”
problems that cause boards to fail during the assembly soldering Operation,
including ionic contamination, where it comes from, the effects of fingerprints,
the significance of gloves, proper cleaning, rinsing and complete drying, types
and porosity of various sealing bags, mechanical protection, slip sheets, sulfur
contaminations, inventory control, and the fundamentals of the reflow/
fusing process, including the formation of intermetallic compound, and
its long-term effects. Also reviews each of the soldering defects caused by
improper packaging and storage. 18th and final videotape in the
Operator Awareness Series. Times: 14 Min.
ORDER CODE- PCB614
MICROSECTION: MANUAL
PREPARATION
Video
Examines the procedure for preparing microsections using manual methods
for the critical grinding and
polishing steps. Provides a
complete discussion of the microsection Process steps, including removing the
coupon from the panel. Thermal stressing Mounting ,
grinding polishing, and etching the specimen. Training package includes
Leader’s Guide and Learner’s Handbook
Time: 27 Min.
ORDER CODE- PCB618
